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Ultra-Thin Grinding Disc Meets Micro-Processing Demand

Release time:

2026-01-15

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A new ultra-thin grinding disc with 0.5mm thickness is developed, specially designed for micro-processing in electronics and semiconductor industries.

A high-tech enterprise focusing on superhard materials has successfully developed an ultra-thin grinding disc with a thickness of only 0.5mm, filling the gap in the domestic micro-processing grinding disc market. The product uses high-strength ceramic bonding agents and ultra-fine diamond abrasives, with excellent toughness and processing precision, and is specially used for cutting and polishing of electronic components and semiconductor wafers. In the actual test, the ultra-thin grinding disc can complete the processing of micro parts without deformation or damage, which is well received by electronic manufacturing enterprises. It is expected to be widely used in the micro-processing field soon.

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Quanzhou Panshi Grinding Tools Co., Ltd

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